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Bar

Electroloy’s LF-300B and LF-800B series Lead free bars are either manually casted or extruded into various shape & sizes for Wave / HASL and Dipping processes. Our bars are formulated for Low – Mid temperature range as well as High temperature solders for special applications.

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                 Low cost LF-315
                                  Good reliability LF-307
                                                   Superior finish LF-801.

 

 

HASL process with Nickel stabilized LF-801HL*

Features

  • Excellent fluidity
  • Bridge free coating for fine pitch circuitry
  • Bright smooth and uniform coating
  • Improved shelf life compared to SnPb
  • Formation of stable intermetallic layer

 

*Electroloy in licensed agreement with Nihon Superior

 

Wave process with Nickel stabilized LF-801B*

Features

  • Lower material Cost
  • Bright, smooth solder joints, free from micro cracks
  • Good metallurgical properties
  • Easy to maintain alloy composition
  • Easy to recycle

 

*Electroloy in licensed agreement with Nihon Superior

 

LF-300 series…LF-315B Low Silver with Copper SAC Alloy

Features

  • Good Wetting
  • Good through hole fill
  • Minimal hot tear
  • Comparable reliability to SAC
  • Low Cost
 
Alloy Code Alloy Composition Solidus (°C ) Liquidus (°C ) Description Attributes Download
Low Temperature Range
LF-302B Sn42/Bi58 138 Eutectic Simple two component alloy. Use in specific sequential soldering operations. Low eutectic temperature. Low cost.
Profile
MSDS
Mid - Temperature Range
LF-303B Sn99.3/Cu0.7 227 Eutectic Mid –range temperature alloy.
Low cost for Dip & Wave Soldering.		 Good mechanical & Thermal fatigue properties.
Good electrical conductivity.
Profile
MSDS
LF-305B Sn96.5/Ag3.5 221 Eutectic

Mid-range temperature alloy.
Simple binary alloy.
Top up bar for SAC.

 Excellent joint strength.
Good thermal fatigue resistance.
Profile
MSDS
LF- 307B * Sn96.5/Ag3.0/Cu0.5 217 219

Mid-range temperature alloy.
Popular SAC alloy for Wave Soldering.

 Good mechanical & thermal fatigue properties.
Low melting point.
Profile
MSDS
LF-315B * Sn99/Ag0.3/ Cu0.7 216 228

Mid-range temperature alloy.
Cheaper to popular SAC

 Good mechanical & thermal fatigue properties
Profile
MSDS
LF-315XB * Sn99/Ag0.3/    Cu0.7 + Bi 216 228 Mid-range temperature alloy.
Cheaper to popular SAC		 Good mechanical & thermal fatigue properties
Profile
MSDS
LF- 801B ** Sn99.3/Cu0.7+ Ni

227

   Eutectic Mid-range temperature alloy.
Popular Sn/Cu/Ni alloy for Dip & Wave Soldering.		 Good electrical conductivity.
Bright, smooth  joints. Good through hole penetration.
Low cost , Low dross.
Profile
MSDS
SN100C † Sn99.3/Cu0.6/Ni + Ge

227

   Eutectic Mid-range temperature alloy.
Popular Sn/Cu/Ni alloy for Dip & Wave Soldering.		 Good electrical conductivity.
Bright, smooth joints. Good through hole penetration.
Low cost, Low dross.
Profile
MSDS
LF-801HL ** Sn99.3/Cu0.7 + Ni

227

   Eutectic

Mid-range temperature alloy . Popular Sn/Cu/Ni alloy for hot air levelling

 Low cost, Low dross. Excellent fluidity & uniform flat surfaces. Bridge free coating.
Profile
MSDS
SN100CL † Sn99.3/Cu0.6/Ni + Ge

227

   Eutectic

Mid-range temperature alloy . Popular Sn/Cu/Ni alloy for hot air levelling

 Low cost, Low dross. Excellent fluidity & uniform flat surfaces. Bridge free coating.
Profile
MSDS
High Temperature Range
LF-331B Sn95/Sb5.0 235 240 High  temperature alloy Higher strength than pure tin.
Profile
MSDS
LF-333B Sn97/Cu3.0 227 300 High  temperature alloy

Higher creep & shear strength. Better thermal resistance than normal tin
Profile
MSDS

 

* Patent No: US 5527628
** Patent No. : Malaysia - MY114845A / Thailand - 16212 / Indonesia - ID 0010052 / China - ZL 99800339.5
† FCT Asia is in license agreement with Nihon Superior for SN100C
For more alloy options see our catalogue [ More ]