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Paste

Electroloy’s Lead-Free Solder Pastes are developed to offer manufacturers the benefit of using one solder paste on a variety of PCBs, under various printing, placement and reflow conditions.

Our solder paste were manufactured under strict process & controlled environment, resulting in very consistent & quality solder paste.

We offer low – mid temperature range of solder paste in different flux type & particle size. We provide good technical support in your use of Electroloy’s solder paste.

Alloy Code Type of Paste Flux Alloy Composition Attributes Download
LF-302P No clean
EM#233		 Sn42 / Bi58 For low temperature application.
Provide excellent activation & leaves low post-processing residue. Good for step soldering applications.
Profile
MSDS
LF-307P No clean
EM#252		 Sn96.5 / Ag3.0 / Cu0.5 Good wetting, good printing on PCB, no corrosion & minimal solder balling after reflow.
Profile
MSDS
LF-315P No clean
EM#253		 Sn99 / Ag0.3 / Cu0.7 Good wetting, good printing on PCB, no corrosion & minimal solder balling after reflow.
Profile
MSDS

EMCO #233-302P

Electroloy’s EMCO #233-302P Lead Free Low Temperature solder paste is specifically design with a rosin base paste flux for lead free solder processes. This paste offers an excellent repeatability & consistency as well as exceptional wetting capabilities for low temperature applications.

Attributes

  • Pin- testable Residue
  • ROL1 to IPC J-STD-004
  • Good slump resistance
  • Good tack performance and printer open time
  • Extended “between-print” abandon time
  • Clear, colorless residues


Ball Test
Wetting Test
Item Characteristics
Viscosity value 150,000 ± 30,000 cp
Flux Activity (per IPC J-STD-004) ROL1
Corrosion of copper plate Pass
Flux content 9.5 ± 0.5%
Wetting test Pass
Solder ball test Pass
Typical Tackiness (gf) 30.6
Slump Test Pass
Typical SIR, at 168 hours (per IPC J-STD-004) Pass (>1 X 1010 Ω)

EMCO #252-307P

Electroloy’s EMCO #252-307P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning.

Attributes

  • Pin- testable Residue
  • ROL0 to IPC J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • Excellent tack performance and printer open time
  • Extended “between-print” abandon time
  • Clear, colorless residues


Ball Test
Wetting Test
Item Characteristics
Viscosity value 200,000 ± 30,000 cp
Flux Activity (per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.0 ± 0.5%
Wetting test Pass
Solder ball test Pass
Typical Tackiness (gf) 32.5
Slump Test Pass
Typical SIR, at 168 hours (per IPC J-STD-004) Pass (>1 X 1010 Ω)

EMCO #253-315P

Electroloy’s EMCO #253-315P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning.

Attributes

  • Pin- testable Residue
  • ROL0 to IPC J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • Excellent tack performance and printer open time
  • Extended “between-print” abandon time
  • Clear, colorless residues


Ball Test
Wetting Test
Item Characteristics
Viscosity value 180,000 ± 30,000 cp
Flux Activity(per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.5± 0.5%
Wetting test Pass
Solder ball test Pass
Typical Tackiness (gf) 38.4
Slump Test Pass
Typical SIR, at 168 hours (per IPC J-STD-004) Pass (>1 X 1010 Ω)