Wire
Electroloy’s lead free wire have reached new heights with our latest technology & experience in the solder wire manufacturing. Our LF-300W & LF-800W series of cored flux wires are now available in :-
- No clean (Halide and Halogen free) Wire
- Fine Wire
- Low Temperature Wire
- Special Solid Wire
No-Clean Wire
Electroloy’s no-clean wires have the following key attributes :-
- Minimum splattering
- Fast wetting
- High reliability post soldering residue
- Low smoke and odour
- Clean finish
Spread test comparison carried out according to JIS 3197
| EM#26 No Clean | EM#53 No Clean | EM#81 Halide Free | EM#79 Halogen Free |
 |
 |
 |
 |
| Spread % ≥ 82 | Spread % ≥ 83 | Spread % ≥ 80 | Spread % ≥ 80 |
Splattering test comparison carried out according to JIS 3197
| EM#26 No Clean | EM#53 No Clean | EM#81 Halide Free | EM#79 Halogen Free |
 |
 |
 |
 |
| Splatter – 4 points | Splatter – 3 points | Splatter – 3 points | Splatter – 3 points |
Electroloy’s core flux chemistry comes in 5 major types, each designed for different flux activation level suitable for different applications. The flux chemistry is compatible with leaded & lead free alloys.
Characteristic of Cored flux
| Properties | EM#17 | EM#26 | EM#53 | EM#81 | EM#79 | Test Method |
|---|---|---|---|---|---|---|
| Flux type | Water Soluble | No Clean | No Clean | Halide Free No Clean | Halogen Free No Clean*3 | - |
| Class type*1 | ORH1 | ROL1 | ROL1 | ROL0 | ROL0 | - |
| Halide Content (Mass %) |
≤ 2.000 | ≤ 0.100 | ≤ 0.440 | 0.00 | 0.00 | JIS Z 3197 8.1.4.2.1 |
| Corrosion Test | NA | Pass | Pass | Pass | Pass | J-STD-004 IPC-TM-650 2.6.15 |
| Surface Insulation Resistance*2 SIR(Ω) | ≥ 1 x 109Ω After Cleaning |
≥ 1 x 109Ω | ≥ 1 x 109Ω | ≥ 1 x 1011Ω | ≥ 1 x 1010Ω | J-STD-004 IPC-TM-650 2.6.3.3 |
| Spread Factor (%) | ≥ 85 | ≥ 82 | ≥ 83 | ≥ 80 | ≥ 80 | JIS Z 3197 8.3.1.1 |
*1 Class type (Halide content in Rosin Base Flux) according to the J-STD-004: ROL0 =0.0%, ROL1=<0.5%
*2 Surface Insulation Resistance: Test Condition: 85 ± 2 °C, 85 ± 2 %; Conditioning Bias: +50V: Measurement : Bias: +100V
*3 Halogen free as per specification of standard IPC 4101B, IEC 61249-2-21 and JPCA-ES01
Core Flux Type
| Flux –Cored Type | Features | Cleaning Method |
|---|---|---|
| Water Soluble EM#17 | High activity water washable cored-flux for repairing through-hole, mixed and surface mount assemblies. More effective comparing to rosin fluxes in soldering difficult-to-solder metals such as brass, nickel and severely oxidized copper. | Water clean |
| No-Clean EM#26 | Lowest and clear flux residue suited for most commercial no-clean hand soldering assemblies. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristics. | No-clean |
| No-Clean EM#53 | Fast wetting action RA cored-flux for consumer electronics assemblies. Flux residue is neither corrosive nor conductive under normal condition of use. Cleaning not necessary for most consumer assemblies. | Bi-polar solvents |
| No-Clean Halide free EM#81 | Halide free with lowest and clear flux residue suited for no-clean hand soldering assemblies. Exhibit fast wetting characteristics. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristics. Suitable for use on different alloys. | No-clean |
|
No-Clean Halogen free*3 |
Halogen free with clear flux residue suited for no-clean hand soldering assemblies. Exhibit good wetting characteristics. Widely and most popular choice for assemblies requiring no-clean, clear residue characteristics. | No-clean |
*3 Halogen free as per specification of standard IPC 4101B, IEC 61249-2-21 and JPCA-ES01
Solder Wire Selection Guide
| Alloy Type | Core Flux Type | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| EM#17 WSF |
EM#53 RA-NC |
EM#26 NC |
EM#81 Halide Free |
EM#79 Halogen Free *3 | ||||||
| LF-303W | ||||||||||
| LF-307W | ||||||||||
| LF-315W | ||||||||||
| LF-801W | ||||||||||
All other types of alloy & core flux combination can be requested ( Enquiry )
*3 Halogen free as per specification of standard IPC 4101B, IEC 61249-2-21 and JPCA-ES01
LF-303W / LF-307W / LF-315W Fine Wire
With enhanced technology in fine wire manufacturing & new cored flux chemistry, we are proud to introduce our 0.17mm lead free wire.
This is suitable for soldering in micro electronics application requiring precision & fine pitch soldering.
LF-302W Low Temperature Wire
Electroloy has developed new capability to extrude Sn/Bi low temperature solid lead free wire. The Sn/Bi ( LF-302W ) low temperature wire has a melting point at 138°C. The diameter ranges from 0.5mm to 2.0mm to suit the needs of various process application for temperature sensitive soldering.
Special Solid Wire
Electroloy has successfully produced special lead free alloy, for example, Sn/Zn, Sn/Ag/Sb and Sn/Bi used in customized and preform application in the form of Ribbon/Wire/Rectangular.
Other hard to draw and non-ductile alloys like bearing alloys, indium and bismuth based fusible alloys can also be requested.
