Huizhou Electroloy Technology Co., Ltd.

Solder Paste

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Lead-free low-temperature alloys:


Alloy number


Alloy composition

Fuse

Feature

Application

LF-302

Sn42 / Bi58

138°C


  Reasonable shear strength and fatigue resistance.


     Can be used for temperature-sensitive parts and   LED welding operations. Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.

LF-329

Sn42 / Bi57/Ag1

139°C


   The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.


LF-323

Sn64 / Bi35/Ag1

170-190°C


 The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.




Lead-free medium temperature alloy:

 

Alloy number

 

Alloy composition

Fuse

Feature

Application

LF-307

Sn96.5 / Ag3.0 / Cu0.5

217-219°C


Excellent mechanical properties and thermalfatigue performance.   

    

Standard SAC alloy for most SMT applications.

LF-315

Sn99 / Ag0.3 / Cu0.7

216-228°C


Excellent mechanical properties and thermal fatigue performance.      

   

Low cost SAC alloy for most SMT applications.

SN100C

Sn99.3/Cu0.6/Ni+Ge

227°C


Excellent mechanical properties, bright and smooth solder joints. Excellent through-holesoldering performance.


SnCu alloy instead of SAC alloy for most SMT applications.



Paste flux


Alloy number

Feature

助焊剂分类

EM#502
(HF)


Halogen-free flux, with high shear strength and excellent printing ability. Can also be used for high-speed printing operations. Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.


ROL0

EM#03PT
(HF)


Halogen-free flux, with high shear strength and excellent printing ability. Has excellent anti-collapse performance and excellent adhesion performance. Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.


ROL0

EM#615


Specially configured flux with excellent printability for ultra-fine pitch welding operation. Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs. It shows excellent wetting on most circuit boards.


ROL1

EM#233


Specially configured flux enhances activity on difficult-to-solder circuit boards and parts. Has excellent anti-collapse performance and excellent adhesion performance. It shows excellent wetting on most circuit boards and leaves only clean residue.


ROL1

EM#255


Specially configured flux enhances activity on difficult-to-solder circuit boards and parts. It shows excellent wetting on most circuit boards. Has excellent anti-collapse performance and excellent adhesion performance. The residue is soft, non-sticky; can be operated on probe test. Residues are clean, printing takes longer and productivity increases.


ROL1

EM#265
(HF)


Halogen-free formulations, temperature range can be widely used, printing operation for a long time. Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency. Has excellent anti-collapse performance and excellent adhesion performance.


ROL0



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