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Electroloy's LF-300B and Sn100C series Lead free bars are either manually casted or extruded into various shape & sizes for Wave / HASL and Dipping processes. Our bars are formulated for Low – Mid temperature range as well as High temperature solders for special applications.

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                 Low cost LF-315
                                  Good reliability LF-307
                                                  Superior finish Sn100C

 

 

HASL process with Nickel stabilized Sn100C*

Features

  • Excellent fluidity
  • Bridge free coating for fine pitch circuitry
  • Bright smooth and uniform coating
  • Improved shelf life compared to SnPb
  • Formation of stable intermetallic layer

 

*FCT Asia in license agreement with Nihon Superior

 

Wave process with Nickel stabilized Sn100C*

Features

  • Lower material Cost
  • Bright, smooth solder joints, free from micro cracks
  • Good metallurgical properties
  • Easy to maintain alloy composition
  • Easy to recycle
 

LF-300 series…LF-315B Low Silver with Copper SAC Alloy

Features

  • Good Wetting
  • Good through hole fill
  • Minimal hot tear
  • Comparable reliability to SAC
  • Low Cost
 
Alloy Code Alloy Composition Solidus (°C ) Liquidus (°C ) Description Attributes Download
Low Temperature Range
LF-302B Sn42/Bi58 138 Eutectic Simple two component alloy. Use in specific sequential soldering operations. Low eutectic temperature. Low cost.
Mid - Temperature Range
LF-303B Sn99.3/Cu0.7 227 Eutectic Mid –range temperature alloy.
Low cost for Dip & Wave Soldering.
Good mechanical & Thermal fatigue properties.
Good electrical conductivity.
LF-305B Sn96.5/Ag3.5 221 Eutectic

Mid-range temperature alloy.
Simple binary alloy.
Top up bar for SAC.

Excellent joint strength.
Good thermal fatigue resistance.
LF- 307B * Sn96.5/Ag3.0/Cu0.5 217 219

Mid-range temperature alloy.
Popular SAC alloy for Wave Soldering.

Good mechanical & thermal fatigue properties.
Low melting point.
LF-307HD * Sn96.5/Ag3.0/Cu0.5 217 219 Mid-range temperature alloy, High temperature dipping Good mechanical strength & electrical conductivity. Cost competitive. Low melting point. Low dross.
LF-315B * Sn99/Ag0.3/ Cu0.7 216 228

Mid-range temperature alloy.
Cheaper to popular SAC

Good mechanical & thermal fatigue properties
LF-315HD * Sn99/Ag0.3/Cu0.7 216 228 Mid-range temperature alloy, High temperature dipping Good wetting. Good through hole fill. Minimal hot tear. Comparable reliability to SAC. Low cost. Lower cooper dissolution rate compared to SAC.
LF-315XB * Sn99/Ag0.3/Cu0.7+Bi 216 228 Mid-range temperature alloy.
Cheaper to popular SAC
Good mechanical & thermal fatigue properties
SN100C ** Sn99.3/Cu0.6/Ni+Ge

227

  Eutectic Mid-range temperature alloy.
Popular Sn/Cu/Ni alloy for Dip & Wave Soldering.
Good electrical conductivity.
Bright, smooth joints. Good through hole penetration.
Low cost, Low dross.
SN100CL ** Sn99.3/Cu0.6/Ni+Ge

227

  Eutectic

Mid-range temperature alloy . Popular Sn/Cu/Ni alloy for hot air levelling

Low cost, Low dross. Excellent fluidity & uniform flat surfaces. Bridge free coating.
High Temperature Range
LF-331B Sn95/Sb5.0 235 240 High  temperature alloy Higher strength than pure tin.
LF-333B Sn97/Cu3.0 227 300 High  temperature alloy

Higher creep & shear strength. Better thermal resistance than normal tin

 

* Patent No: US 5527628
** FCT Asia is in license agreement with Nihon Superior for SN100C
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