Paste
Electroloy's Lead-Free Solder Pastes are developed to offer manufacturers the benefit of using one solder paste on a variety of PCBs, under various printing, placement and reflow conditions.
Our solder paste were manufactured under strict process & controlled environment, resulting in very consistent & quality solder paste.
We offer low – mid temperature range of solder paste in different flux type & particle size. We provide good technical support in your use of Electroloy's solder paste.

Alloy Code | Type of Paste Flux | Alloy Composition | Attributes | Download | |
---|---|---|---|---|---|
LF-302P | Lead Free EMCO#233 |
Sn42 / Bi58 | Pin- testable Residue, Good slump resistance, Good tack performance and printer open time, Extended "between-print" abandon time, Clear, colorless residues. | ||
LF-307P | Halogen Free EMCO#265HF |
Sn96.5 / Ag3.0 / Cu0.5 | Pin-testable residue, Enhanced activity for tough to solder boards and components, Excellent slump resistance, Excellent tack performance and printer open time, Extended "between-print" abandon time, Clear, colorless residues, Halogen Free. | ||
No clean EMCO#515 |
Sn96.5 / Ag3.0 / Cu0.5 | Excellent printing capability, Wide Reflow Window, minimal solder balling after reflow, Anti solder void formulation, Excellent paste in Hole Application. | |||
LF-315P | Halogen Free EMCO#265HF |
Sn99.0 / Ag0.3 / Cu0.7 | Pin-testable residue, Enhanced activity for tough to solder boards and components, Excellent slump resistance, Excellent tack performance and printer open time, Clear, Colorless residues, Halogen free. | ||
No clean EMCO#515 |
Sn99.0 / Ag0.3 / Cu0.7 | Excellent printing capability, Wide reflow window, Reduce solders balling, Anti-Solder void formulation, Excellent paste in Hole Application. | |||
SN100CP | Lead Free Paste EMCO#255 | SN100C | Low dross formation, Good through hole penetration, Reduce copper erosion, Less aggressive, Close to eutectic temperature. |
EMCO #233-302P
Electroloy's EMCO #233-302P Lead Free Low Temperature solder paste is specifically design with a rosin base paste flux for lead free solder processes. This paste offers an excellent repeatability & consistency as well as exceptional wetting capabilities for low temperature applications.
Attributes
|
Item | Characteristics |
---|---|
Viscosity value | 150,000 ± 30,000 cp |
Flux Activity (per IPC J-STD-004) | ROL1 |
Corrosion of copper plate | Pass |
Flux content | 9.5 ± 0.5% |
Wetting test | Pass |
Solder ball test | Pass |
Typical Tackiness (gf) | 30.6 |
Slump Test | Pass |
Typical SIR, at 168 hours | Pass (>1 X 1010 Ω) |
EMCO #265HF-307P
Electroloy's EMCO#265HF-307P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. EMCO#265HF-307P also is a Halogen Free product.
Attributes
|
Item | Characteristics |
---|---|
Viscosity | 160,000 ± 30,000 cp |
Flux Activity (per IPC J-STD-004) | ROL0 |
Corrosion of copper plate | Pass |
Flux content | 11.5 ± 0.5% |
Wetting test | Pass |
Solder ball test | Pass |
Slump Test | Pass |
Typical SIR, at 168 hours | Pass (≥1 X 109 Ω) |
EMCO #515-307P
Electroloy's EMCO#515-307P No Clean Solder Paste is specially formulated for lead free soldering applications. EMCO#515-307P uses a high shear resistance ingredient that offers excellent print capability. This flux system can withstand high preheating temperature without discoloration. EMCO#515-307P delivers excellent wetting and soldering on most board finishes including OSPs, reducing solder balls formation and solder beading.
Attributes
|
Item | Characteristics |
---|---|
Viscosity value | 160,000 ± 30,000 cp |
Flux Activity(per IPC J-STD-004) | ROL0 |
Corrosion of copper plate | Pass |
Flux content | 11.0± 0.5% |
Wetting test | Pass |
Solder ball test | Pass |
Flux Residue Tackiness Test | Pass |
Slump Test | Pass (10 min at 150°C) Pass (0.2mm pitch-no bridging) |
Typical SIR, at 168 hours | Pass (≥1 X 1010 Ω) |
EMCO #265HF-315P
Electroloy's EMCO#265HF-315P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. EMCO#265HF-315P also is a Halogen Free product.
Attributes
|
Item | Characteristics |
---|---|
Viscosity | 160,000 ± 30,000 cp |
Flux Activity(per IPC J-STD-004) | ROL0 |
Corrosion of copper plate | Pass |
Flux content | 11.5± 0.5% |
Wetting test | Pass |
Solder ball test | Pass |
Slump Test | Pass |
Typical SIR, at 168 hours | Pass (≥1 X 109 Ω) |
EMCO#515-315P
Electroloy's EMCO#515-315P No Clean Solder Paste is specially formulated for lead free soldering applications. EMCO#515-315P uses a high shear resistance ingredient that offers excellent print capability. This flux system can withstand high preheating temperature without discoloration.EMCO#515-315P delivers excellent wetting and soldering on most board finishes including OSPs, reducing solder balls formation and solder beading.
Attributes
|
Item | Characteristics |
---|---|
Viscosity | 160,000 ± 30,000 cp |
Flux Activity(per IPC J-STD-004) | ROL0 |
Corrosion of copper plate | Pass |
Flux content | 11.0± 0.5% |
Spread test | Pass |
Solder ball test | Pass |
Flux Residue Tackiness Test | Pass |
Slump Test | Pass |
Typical SIR, at 168 hours | Pass (≥1 X 109 Ω) |
EMCO#255-SN100CP
Electroloy's EMCO#255-SN100CP No Clean Solder Paste is a rosin based solder paste containing tin, copper, nickel and germanium. SN100C has a number of excellent soldering properties and is now been firmly established as one of the most popular lead free wave soldering alloy in global electronics industry.
Attributes The patented addition of nickel to the tin-copper eutectic with "Ge" offers the following advantages:
|
Item | Characteristics |
---|---|
Viscosity | 160 ± 30 Pa.s |
Flux Activity(per IPC J-STD-004) | ROM1 |
Corrosion of copper plate | Pass |
Flux content | 12.0± 0.5% |
Spread test | >82.0% |
Solder ball test | Pass |
Slump Test | Pass (0.3mm) |
Typical SIR, at 168 hours | (≥1 X 109 Ω) |