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Paste

Electroloy's Lead-Free Solder Pastes are developed to offer manufacturers the benefit of using one solder paste on a variety of PCBs, under various printing, placement and reflow conditions.

Our solder paste were manufactured under strict process & controlled environment, resulting in very consistent & quality solder paste.

We offer low – mid temperature range of solder paste in different flux type & particle size. We provide good technical support in your use of Electroloy's solder paste.

Alloy Code Type of Paste Flux Alloy Composition Attributes Download
LF-302P Lead Free
EMCO#233
Sn42 / Bi58 Pin- testable Residue, Good slump resistance, Good tack performance and printer open time, Extended "between-print" abandon time, Clear, colorless residues.
LF-307P Halogen Free
EMCO#265HF
Sn96.5 / Ag3.0 / Cu0.5 Pin-testable residue, Enhanced activity for tough to solder boards and components, Excellent slump resistance, Excellent tack performance and printer open time, Extended "between-print" abandon time, Clear, colorless residues, Halogen Free.
No clean
EMCO#515
Sn96.5 / Ag3.0 / Cu0.5 Excellent printing capability, Wide Reflow Window, minimal solder balling after reflow, Anti solder void formulation, Excellent paste in Hole Application.
LF-315P Halogen Free
EMCO#265HF
Sn99.0 / Ag0.3 / Cu0.7 Pin-testable residue, Enhanced activity for tough to solder boards and components, Excellent slump resistance, Excellent tack performance and printer open time, Clear, Colorless residues, Halogen free.
No clean
EMCO#515
Sn99.0 / Ag0.3 / Cu0.7 Excellent printing capability, Wide reflow window, Reduce solders balling, Anti-Solder void formulation, Excellent paste in Hole Application.
SN100CP Lead Free Paste EMCO#255 SN100C Low dross formation, Good through hole penetration, Reduce copper erosion, Less aggressive, Close to eutectic temperature.

EMCO #233-302P

Electroloy's EMCO #233-302P Lead Free Low Temperature solder paste is specifically design with a rosin base paste flux for lead free solder processes. This paste offers an excellent repeatability & consistency as well as exceptional wetting capabilities for low temperature applications.

Attributes

  • Pin- testable Residue
  • ROL1 to IPC J-STD-004
  • Good slump resistance
  • Good tack performance and printer open time
  • Extended "between-print" abandon time
  • Clear, colorless residues

Item Characteristics
Viscosity value 150,000 ± 30,000 cp
Flux Activity (per IPC J-STD-004) ROL1
Corrosion of copper plate Pass
Flux content 9.5 ± 0.5%
Wetting test Pass
Solder ball test Pass
Typical Tackiness (gf) 30.6
Slump Test Pass
Typical SIR, at 168 hours Pass (>1 X 1010 Ω)

EMCO #265HF-307P

Electroloy's EMCO#265HF-307P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. EMCO#265HF-307P also is a Halogen Free product.

Attributes

  • Pin- testable Residue
  • ROL0 to IPC J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • Excellent tack performance and printer open time
  • Extended "between-print" abandon time
  • Clear, colorless residues
  • Halogen Free

Item Characteristics
Viscosity 160,000 ± 30,000 cp
Flux Activity (per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.5 ± 0.5%
Wetting test Pass
Solder ball test Pass
Slump Test Pass
Typical SIR, at 168 hours Pass (≥1 X 109 Ω)

EMCO #515-307P

Electroloy's EMCO#515-307P No Clean Solder Paste is specially formulated for lead free soldering applications. EMCO#515-307P uses a high shear resistance ingredient that offers excellent print capability. This flux system can withstand high preheating temperature without discoloration. EMCO#515-307P delivers excellent wetting and soldering on most board finishes including OSPs, reducing solder balls formation and solder beading.

Attributes

  • Excellent Printing Capability - Suitable for ultra-fine pitch soldering operation
  • Wide Reflow Window - Increase production process window
  • Reduce Solderballing - Minimize rework
  • Anti-Solder Void Formulation - Meet IPC 7095 Voids Performance Classification Class III
  • Excellent Paste In Hole Application - For printing, dispensing (or pin transfer) SMT applications

Item Characteristics
Viscosity value 160,000 ± 30,000 cp
Flux Activity(per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.0± 0.5%
Wetting test Pass
Solder ball test Pass
Flux Residue Tackiness Test Pass
Slump Test Pass (10 min at 150°C)
Pass (0.2mm pitch-no bridging)
Typical SIR, at 168 hours Pass (≥1 X 1010 Ω)

EMCO #265HF-315P

Electroloy's EMCO#265HF-315P No Clean Solder Paste is a rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. EMCO#265HF-315P also is a Halogen Free product.

Attributes

  • Pin- testable residue
  • ROL0 to IPC J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • Excellent tack performance and printer open time
  • Extended "between-print" abandon time
  • Clear, colorless residues
  • Halogen Free


Item Characteristics
Viscosity 160,000 ± 30,000 cp
Flux Activity(per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.5± 0.5%
Wetting test Pass
Solder ball test Pass
Slump Test Pass
Typical SIR, at 168 hours Pass (≥1 X 109 Ω)

EMCO#515-315P

Electroloy's EMCO#515-315P No Clean Solder Paste is specially formulated for lead free soldering applications. EMCO#515-315P uses a high shear resistance ingredient that offers excellent print capability. This flux system can withstand high preheating temperature without discoloration.EMCO#515-315P delivers excellent wetting and soldering on most board finishes including OSPs, reducing solder balls formation and solder beading.

Attributes

  • Excellent Printing Capability - Suitable for ultra-fine pitch soldering operation
  • Wide Reflow Window - Increase production process window
  • Reduce Solderballing - Minimize rework
  • Anti-Solder Void Formulation - Meet IPC 7095 Voids Performance Classification Class III
  • Excellent Paste In Hole Application - For printing, dispensing (or pin transfer) SMT applications


Item Characteristics
Viscosity 160,000 ± 30,000 cp
Flux Activity(per IPC J-STD-004) ROL0
Corrosion of copper plate Pass
Flux content 11.0± 0.5%
Spread test Pass
Solder ball test Pass
Flux Residue Tackiness Test Pass
Slump Test Pass
Typical SIR, at 168 hours Pass (≥1 X 109 Ω)

EMCO#255-SN100CP

Electroloy's EMCO#255-SN100CP No Clean Solder Paste is a rosin based solder paste containing tin, copper, nickel and germanium. SN100C has a number of excellent soldering properties and is now been firmly established as one of the most popular lead free wave soldering alloy in global electronics industry.

Attributes

The patented addition of nickel to the tin-copper eutectic with "Ge" offers the following advantages:

  • Low cost lead free alloy
  • Low dross formation
  • Bright, smooth solder joints that is free from gross micro cracks.
  • Good through hole penetration.
  • Reduce copper erosion
  • Less aggressive on stainless steel & other solder pot materials
  • Close to eutectic temperature
  • Easy to maintain alloy composition


Item Characteristics
Viscosity 160 ± 30 Pa.s
Flux Activity(per IPC J-STD-004) ROM1
Corrosion of copper plate Pass
Flux content 12.0± 0.5%
Spread test >82.0%
Solder ball test Pass
Slump Test Pass (0.3mm)
Typical SIR, at 168 hours (≥1 X 109 Ω)