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General Adhesive
|
Product name |
Extrusion ratio (g/min) |
Appearance |
Tackfreetime |
Application fields |
|
EMSA 209 |
50 |
Paste |
<20min |
Bonding of electrical components Automobile part bonding LED part bonding General bonding |
|
EMSA 209x |
300 |
Paste |
<20min |
|
|
EMSA 357 |
1000 |
Paste |
<10min |
Encapsulatant
|
Product name |
Mixing ratio |
Viscosity (mPa.s) |
Thermal conductivity |
Hardness (Shore A) |
Curing time |
Application fields |
|
EMSD 526 |
1：1 |
4500 |
0.6 |
60 |
8-16 hrs |
LED embedment Electronic converter embedment General equipment embedment Power embedment |
|
EMSD 528 |
1：1 |
6000 |
0.8 |
70 |
8-16 hrs |
|
|
EMSD 528T |
1：1 |
25000 |
1.4 |
10 |
4-16 hrs |
|
|
EMSD 510 |
10：1 |
450 |
N/A |
Jelly Texture |
8-16 hrs |
|
|
EMSD 580 |
1：1 |
3000 |
N/A |
20 |
10 hrs |
Thermal Grease
|
Product name |
Thermalconductivity |
Specific gravity |
Application fields |
|
EMSG 701 |
1 |
2.12 |
RadiatorPower module |
|
EMSG 702 |
1.3 |
2.8 |
|
|
EMSG 704 |
3 |
2.6 |
Conformal Coating ( Silicone )
|
Product name |
Viscosity (mPa.s) |
Tack free time |
Application fields |
|
EMSF 311 |
300 |
15min
|
Protection for PCBA |
|
EMSF 313 |
1000 |
20min |
Conformal Coating ( Heat Cure )
|
Product name |
Application fields |
Appearance |
Recommended curing condition |
Viscosity (mPa.s) |
Specific gravity (@25℃) |
|
EMSF-2100HC-T |
PCBA三防胶 PCBA three proofing glue |
棕色透明液体 Brown transparent liquid |
80℃ 1h |
50±10% |
0.85±10% |
|
EMSF-5500N-B/ EMSF-5600N-B |
液晶屏幕玻璃表面保护 LCD screen glass surface protection |
蓝色膏体 Blue paste |
120℃ 10-15min
180℃ 5-7min |
25000±10% |
1.2±5% |
Conformal Coating ( Natural Cure )
|
Product name |
Application fields |
Appearance |
Surface dry time |
Recommended curing condition |
Viscosity (mPa.s) |
Specific gravity (@25℃) |
|
EMSF-1100N-B/ EMSF-1100N-B/ EMSF-5100N-B EMSF-5100N-B |
LCD Conformal protection for LCD electrode |
Blue transparent liquid |
5-7min |
25℃ 24h
|
300±10% |
0.8±5% |
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