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Lead-free low-temperature alloys:
Alloy number
Alloy composition
Fuse
Feature
Application
LF-302
Sn42 / Bi58
138°C
Reasonable shear strength and fatigue resistance.
Can be used for temperature-sensitive parts and LED welding operations. Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.
LF-329
Sn42 / Bi57/Ag1
139°C
The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.
LF-323
Sn64 / Bi35/Ag1
170-190°C
The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.
Lead-free medium temperature alloy:
LF-307
Sn96.5 / Ag3.0 / Cu0.5
217-219°C
Excellent mechanical properties and thermalfatigue performance.
Standard SAC alloy for most SMT applications.
LF-315
Sn99 / Ag0.3 / Cu0.7
216-228°C
Excellent mechanical properties and thermal fatigue performance.
Low cost SAC alloy for most SMT applications.
SN100C
Sn99.3/Cu0.6/Ni+Ge
227°C
Excellent mechanical properties, bright and smooth solder joints. Excellent through-holesoldering performance.
SnCu alloy instead of SAC alloy for most SMT applications.
Paste flux
助焊剂分类
EM#502 (HF)
Halogen-free flux, with high shear strength and excellent printing ability. Can also be used for high-speed printing operations. Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
ROL0
EM#503PT (HF)
Halogen-free flux, with high shear strength and excellent printing ability. Has excellent anti-collapse performance and excellent adhesion performance. Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
EM#615
Specially configured flux with excellent printability for ultra-fine pitch welding operation. Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs. It shows excellent wetting on most circuit boards.
ROL1
EM#233
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts. Has excellent anti-collapse performance and excellent adhesion performance. It shows excellent wetting on most circuit boards and leaves only clean residue.
EM#255
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts. It shows excellent wetting on most circuit boards. Has excellent anti-collapse performance and excellent adhesion performance. The residue is soft, non-sticky; can be operated on probe test. Residues are clean, printing takes longer and productivity increases.
EM#265 (HF)
Halogen-free formulations, temperature range can be widely used, printing operation for a long time. Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency. Has excellent anti-collapse performance and excellent adhesion performance.
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